Thomas Reger and Gary Reichl of Greene Tweed’s Advanced Technology Group are the authors of a poster paper entitled “Science of Sealing: Advanced Materials for High-Temperature Applications,” which will be presented at the Advanced Semiconductor Manufacturing Conference, Virtual ASMC 2020, August 24-26, 2020.
Registration is required to virtually attend the conference, where the paper will be available for viewing through September 26, 2020. To register, visit Semi.org here.
ASMC is the leading international technical conference for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing is a combined effort by device makers, equipment and materials suppliers, and academics. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies.
About Greene Tweed
Greene Tweed is a leading global manufacturer of high-performance thermoplastics, composites, seals, and engineered components. Combining more than 150 years of technical expertise and commercial knowledge in a variety of markets, Greene Tweed collaborates with customers to develop engineered solutions that meet challenging performance requirements and reduce total cost of ownership.
Greene Tweed products are sold and distributed worldwide. For additional information, call +1.215.256.9521, or visit our website at https://www.gtweed.com.